Introduction to Semiconductor Manufacturing Technology

Introduction to Semiconductor Manufacturing Technology

by Hong Xiao

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Introduction to Semiconductor Manufacturing Technology by Hong Xiao

IC chip manufacturing processes, such as photolithography, etch, CVD, PVD, CMP, ion implantation, RTP, inspection, and metrology, are complex methods that draw upon many disciplines. [i]Introduction to Semiconductor Manufacturing Technologies, Second Edition[/i] thoroughly describes the complicated processes with minimal mathematics, chemistry, and physics; it covers advanced concepts while keeping the contents accessible to readers without advanced degrees. Designed as a textbook for college students, this book provides a realistic picture of the semiconductor industry and an in-depth discussion of IC chip fabrication technology. The text focuses on current fabrication technologies, but older technologies are discussed for historical context.

Product Details

ISBN-13: 9780819490940
Publisher: SPIE Press
Publication date: 11/19/2012
Series: SPIE Press Monographs
Sold by: Barnes & Noble
Format: NOOK Book
File size: 38 MB
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Table of Contents

1: Introduction
2: Introduction of IC Fabrication
3: Semiconductor Basics
4: Wafer Manufacturing
5: Thermal Processes
6: Photolithography
7: Plasma Basics
8: Ion Implantation
9: Etch
10: CVD and Dielectric Thin Film
11: Metallization
12: CMP (Chemical Mechanical Polishing)
13: Process Integration
14: CMOS Processes
15: Summary and Future Trends


The semiconductor industry is developing rapidly with new technology introduced almost on a daily basis. The device feature size is shrinking continuously and the number of transistors on an integrated circuit (IC) chip is increasing rapidly, as predicted by Moore's law. Compared with only a decade ago, IC fabrication processing technology has become more complicated.

This book thoroughly describes the complicated IC chip manufacturing processes in a semiconductor fab, using minimum mathematics, chemistry, and physics. It covers the advanced technologies while keeping the contents simple and easy to understand for readers without science and engineering degrees. It focuses on the newest IC fabrication technologies and describes the older technologies to provide better understanding of the historical development. The processes chosen for the book are very close to those in real fabs, especially on process troubleshooting and process and hardware relations.

This book is intended for technical and college students who need an in-depth understanding of the technology as they prepare to find a job in the field. It is also intended as a reference book for engineering students and to provide a more realistic picture of the semiconductor industry. Industry operators, technicians, engineers, and personnel in sales, marketing, administration, and management can also benefit. This book can help them to learn more about their jobs, improve their troubleshooting and problem-solving skills, and raise their career development potential.

Chapter 1 briefly reviews the history of the semiconductor industry and describes semiconductor manufacturing processes. Chapter 2 introduces basic semiconductor fabrication including yield, cleanroom, semiconductor fab, and IC chip test and packaging. Chapter 3 gives a brief review of fabrication semiconductor devices, IC chips, and early technologies in semiconductor processing. Crystal structure, singles, crystal silicon wafer manufacturing, and epitaxial silicon growth are described in Chapter 4. Chapter 5 lists and discusses thermal processes, including oxidation, diffusion, annealing, alloying, and reflow processes. Rapid thermal processes (RTP) and conventional furnace thermal processes are discussed. Chapter 6 details the photolithography process. Fundamentals of plasmas used in semiconductor processing are covered in Chapter 7; it introduces plasma applications, DC bias, and plasma-process relations. Chapter 8 discusses the ion implantation process. Chapter 9 gives a detailed description of etch processes including wet and dry etches; chemical, reactive ion etch (RIE), and physical etches; and patterned and blanket etch processes. Basic chemical vapor deposition (CVD) and dielectric thin-film deposition processes, including dielectric CVD processes, process trends, troubleshooting, and future trends are discussed in detail in Chapter 10. Chapter 11 covers metallization, metal CVD, and physical vapor deposition (PVD) processes. It also describes the copper metallization process. Planarization processes including chemical mechanical polishing (CMP) are discussed in Chapter 12. Chapter 13 discusses process integration. Chapter 14 diagrams CMOS process flows including an advanced CMOS process flow with copper and low-k interconnection. Chapter 15 predicts the future development of the semiconductor industry.

Many people helped me to write this book. I especially appreciate the useful information provided by my current and former colleagues: Lou Frenzel, Thomas E. Thompson, Ole Krogh, Tony Shi, Alberto Quinonez, Lance Kinney, Scott Bolton, and Steve Reedy. Many of my students helped me by proofreading end improving the book. I especially express my thanks to Wayne Parent, Jeffrey Carroll, Boyd Woods, and Ronald Tabery.

I would also like to thank the following reviewers for their valuable suggestions: Professor Dave Hata, Portland Community College; Professor Fred Lavender, Albuquerque Technical Institute; Professor Gene Stouder, Southwest Texas State University; Professor Bassam Matar, Glendale Community College; Professor Carlo Sapijaszko, DeVry Institute of Technology; Professor George Shaiffer, Pikes Peak Community College; Professor Val Shires, Gwinnett Technical Institute; and Professor Devinder Sud, DeVry Institute.

Hong Xiao

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