Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in theglobal semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computersrely onlead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth designknowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behaviorandits application in failureassessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failuresubject tothermal cycling,mechanical bending fatigue, vibration fatigueand board-level drop impact tests.
|Publisher:||Springer New York|
|Product dimensions:||6.10(w) x 9.25(h) x (d)|
Table of ContentsIntroduction.- Theory on Mechanics of Solder Materials.-Mechanical Properties and Constitutive Models.- Fatigue Life Prediction Models.- Finite Element Analysis and Design-For-Reliability.- Thermo-Mechanical Reliability Test and Analysis.- Dynamic Mechanical Reliability Test and Analysis.- Thermal Cycling Aging Effects on Board-Level Drop Test Result