Lead Free Solder: Mechanics and Reliability

Lead Free Solder: Mechanics and Reliability

by John Hock Lye Pang

Paperback(2012)

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Overview

Lead Free Solder: Mechanics and Reliability by John Hock Lye Pang

Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in theglobal semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computersrely onlead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth designknowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behaviorandits application in failureassessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failuresubject tothermal cycling,mechanical bending fatigue, vibration fatigueand board-level drop impact tests.

Product Details

ISBN-13: 9781489991164
Publisher: Springer New York
Publication date: 10/30/2014
Edition description: 2012
Pages: 175
Product dimensions: 6.10(w) x 9.25(h) x (d)

Table of Contents

Introduction.- Theory on Mechanics of Solder Materials.-Mechanical Properties and Constitutive Models.- Fatigue Life Prediction Models.- Finite Element Analysis and Design-For-Reliability.- Thermo-Mechanical Reliability Test and Analysis.- Dynamic Mechanical Reliability Test and Analysis.- Thermal Cycling Aging Effects on Board-Level Drop Test Result

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