On-Chip Power Delivery and Management

On-Chip Power Delivery and Management

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Product Details

ISBN-13: 9783319805610
Publisher: Springer International Publishing
Publication date: 05/30/2018
Edition description: Softcover reprint of the original 4th ed. 2016
Pages: 742
Product dimensions: 6.10(w) x 9.25(h) x (d)

About the Author

Eby G. Friedman was born in Jersey City, New Jersey in 1957. He received the B. S. degree from Lafayette College, Easton, Pennsylvania in 1979, and the M. S. and Ph. D. degrees from the University of California, Irvine, in 1981 and 1989, respectively, all in electrical engineering.
He was with Philips Gloeilampen Fabrieken, Eindhoven, The Netherlands, in 1978 where he worked on the design of bipolar differential amplifiers. From 1979 to 1983, he was employed by Hughes Aircraft Company, Newport Beach, California, working in the areas of custom IC design, software compatible gate array design, one- and two-dimensional device modeling, circuit modeling, and double level metal process development. From 1983 to 1991, he was employed at Hughes Aircraft Company, Carlsbad, California, rising to the position of Manager of the Signal Processing Design and Test Department, responsible for the design and test of high performance VLSI/VHSIC CMOS and BIMOS digital and analog IC's, the development of supporting design and test methodologies and CAD tools, functional and parametric test, and the development of high performance and high resolution DSP and oversampled systems.

Dr. Friedman has been with the Department of Electrical and Computer Engineering at the University of Rochester, Rochester, New York, since 1991, where he is a Distinguished Professor and Director of the High Performance VLSI/IC Design and Analysis Laboratory. He previously was the Director of the Center for Electronic Imaging Systems. He is also a Visiting Professor at the Technion - Israel Institute of Technology. He also directs the Technion Advanced Circuits Research Center (ACRC). His current research and teaching interests are in high performance synchronous digital and mixed-signal microelectronic design and analysis with application to high speed portable processors and low power wireless communications.

He has authored twelve book chapters and many papers in the fields of high speed and low power CMOS design techniques, interconnect and substrate noise, pipelining and retiming, three-dimensional integration, and the theory and application of power and synchronous clock distribution networks.

Dr. Friedman has also authored or edited sixteen books, including Clock Distribution Networks in VLSI Circuits and Systems (IEEE Press, 1995), High Performance Clock Distribution Networks (Kluwer Academic Publishers, 1997), Analog Design Issues in Digital VLSI Circuits and Systems (Kluwer Academic Publishers, 1997), Timing Optimization through Clock Skew Scheduling (Kluwer Academic Publishers, 2000 and 2009), On-Chip Inductance in High Speed Integrated Circuits (Kluwer Academic Publishers, 2001), Power Distribution Networks in High Speed Integrated Circuits (Kluwer Academic Publishers, 2004), Multi-Voltage CMOS Circuit Design (John Wiley & Sons Press, 2006), Power Distribution Networks with On-Chip Decoupling Capacitors (Springer Verlag, 2008 and 2011), Three-Dimensional Integrated Circuit Design (Morgan Kaufmann, 2009), and High Performance Integrated Circuit Design (McGraw-Hill Publishers, 2012).

Dr. Friedman is a Fellow of the IEEE, Chair of the steering committee for the IEEE Transactions on Very Large Scale Integration (VLSI) Systems, a Regional Editor of the Journal of Circuits, Systems and Computers, a Member of the editorial board of the Analog Integrated Circuits and Signal Processing, Microelectronics Journal, Journal of Low Power Electronics , and Journal of VLSI Signal Processing, and a Member of the technical program committee of a number of conferences.

He has been Editor-In-Chief of the IEEE Transactions on Very Large Scale Integration (VLSI) Systems, a Distinguished Lecturer of the IEEE CAS Society, a Member of the editorial board of the Proceedings of the IEEE and IEEE Transactions on Circuits and Systems II: Analog and Digital Signal Processing, a member of the IEEE Circuits and Systems (CAS) Society Board of Governors, CAS liaison to the IEEE Solid-State Circuits Society (SSCS) , Guest editor of several special journal issues, Chair of the VLSI Systems and Applications IEEE Circuits and Systems Society Technical Committee, Chair of the Electron Devices Chapter of the IEEE Rochester Section, and General/Program/Technical Co-Chair of the 1997 International Workshop on Clock Distribution Networks, 2000 IEEE Workshop on Signal Processing Systems, 2003 and 2004 IEEE International Workshop on System-on-Chip for Real-Time Applications, 2004 IEEE International Conference on Electronics, Circuits, and Systems, 2006 IEEE International Symposium on Circuits and Systems, and 2007 IEEE International Symposium on Networks on Chip (NoC).

Dr. Friedman is a Fulbright scholar and has been a recipient of the Howard Hughes Masters and Doctoral Fellowships, an IBM University Research Award, an NSF Research Initiation Award, a DoD Augmentation Award for Science and Engineering Research Training, the 1996 Outstanding Chapter Chairman for IEEE Rochester section award, a GRC Inventor Recognition Award, a University of Rochester College of Engineering Teaching Excellence Award, the University of Rochester Graduate Teaching Award, and the IEEE Circuits and Systems 2013 Charles A. Desoer Technical Achievement Award.

Table of Contents

Introduction.- Inductive Properties of Electric Circuits.- Properties of On-Chip Inductive Current Loops.- Electromigration.- Scaling Trends of On-Chip Power Distribution Noise.- High Performance Power Distribution Systems.- On-Chip Power Distribution Networks.- Computer-Aided Design and Analysis.- Closed Form Expressions for Fast IR Drop Analysis.- Inductive Properties of On-Chip Power Distribution Grids.- Variation of Grid Inductance with Frequency.- Inductance/Area/Resistance Tradeoffs Inductance Model of Interdigitated Power and Ground Distribution Networks.- On-chip Power Noise Reduction Techniques in High Performance ICs.- Impedance/Noise Issues in On-Chip Power Distribution Networks.- Impedance Characteristics of Multi-Layer Grids.- Multi-Layer Interdigitated Power Distribution Networks.- Multiple On-Chip Power Supply Systems.- On-Chip Power Distribution Grids with Multiple Supply Voltages.- Background for Decoupling Capacitance.- Decoupling Capacitors for Multi-Voltage Power Distribution Systems.- Effective Radii of On-Chip Decoupling Capacitors.- Efficient Placement of Distributed On-Chip Decoupling Capacitors.- Simultaneous Co-Design of Distributed On-Chip Power Supplies and Decoupling Capacitors.- Conclusions.

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