ISBN-10:
0791835650
ISBN-13:
9780791835654
Pub. Date:
01/29/2001
Publisher:
American Society of Mechanical Engineers
Packaging, Reliability and Manufacturing Issues Associated with Electronic and Photonic Products

Packaging, Reliability and Manufacturing Issues Associated with Electronic and Photonic Products

by Suresh Sitaraman

Paperback

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Overview

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION NOVEMBER 11-16, 2001 NEW YORK,NEW YORK Collection of 37 full-length, peer-reviewed technical papers that cover the leading edge in research and innovations in the following major topic areas: Thermal and Thermo-Mechanical Issues in Electronic Packaging; Nano-and Micro-Scale Compliant Interconnects for Electronic Packages; Thermal Management of Packaging Problems; Wafer and Electronic Manufacturing in Semiconductor Processing; Mechanics of SMT and Photonic Structures.

Product Details

ISBN-13: 9780791835654
Publisher: American Society of Mechanical Engineers
Publication date: 01/29/2001
Pages: 240
Product dimensions: 6.00(w) x 1.25(h) x 9.00(d)

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