Packaging, Reliability and Manufacturing Issues Associated with Electronic and Photonic Products available in Paperback
- Pub. Date:
- American Society of Mechanical Engineers
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION NOVEMBER 11-16, 2001 NEW YORK,NEW YORK Collection of 37 full-length, peer-reviewed technical papers that cover the leading edge in research and innovations in the following major topic areas: Thermal and Thermo-Mechanical Issues in Electronic Packaging; Nano-and Micro-Scale Compliant Interconnects for Electronic Packages; Thermal Management of Packaging Problems; Wafer and Electronic Manufacturing in Semiconductor Processing; Mechanics of SMT and Photonic Structures.