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McGraw-Hill Professional Publishing
Printed Circuits Handbook / Edition 6

Printed Circuits Handbook / Edition 6

by Clyde Coombs, Happy Holden


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Printed Circuits Handbook / Edition 6

The World's #1 Guide to Printed Circuit Boards_Now Completely Updated with the Latest Information on Lead-Free Manufacturing!

The best reference in the field for over 30 years, the Printed Circuits Handbook equips you with definitive coverage of every facet of printed circuit assemblies_from design methods to fabrication processes. Now completely revised and updated, the Sixth Edition presents the latest information on lead-free manufacturing, including lead-free PCB design and fabrication techniques, lead-free materials, and lead-free reliability models. The new edition also explores best practices for High Density Interconnect (HDI), as well as flexible printed circuits.

Written by a team of experts from around the world, the Sixth Edition of this renowned handbook contains cutting-edge material on engineering and design of printed circuits fabrication methods…assembly processes… solders and soldering…test and repair…waste minimization and treatment …quality and reliability of printed circuit processes…and much more. The updated Printed Circuits Handbook provides you with:

  • Unsurpassed guidance on printed circuits_from design to manufacturing
  • Over 500 illustrations, charts, and tables for quick access to essential data
  • New to this edition: New coverage of lead-free PCB design and manufacturing techniques, lead-free materials, lead-free reliability models,
    best practices for High Density Interconnect (HDI), and flexible printed circuits

Inside This State-of-the-Art Printed Circuits Guide

• Introduction to Printed Circuits • Engineering and Design of Printed Circuits Fabrication Processes • Assembly Processes • Solders and Soldering • Test and Repair • Waste Minimization and Treatment • Quality and Reliability of Printed Circuit Processes • Flexible Circuits

Product Details

ISBN-13: 9780071467346
Publisher: McGraw-Hill Professional Publishing
Publication date: 08/29/2007
Series: McGraw-Hill Handbooks Ser.
Edition description: REV
Pages: 1000
Product dimensions: 7.70(w) x 9.50(h) x 2.40(d)

About the Author

Clyde F. Coombs, Jr. (Los Altos, CA) recently retired from Hewlett-Packard. He is the editor of all five editions of the Printed Circuits Handbook, the first of which was published in 1967. He is also the editor of two editions of the Electronic Instrument Handbook.

Table of Contents

List of Contributors


Part 1: Lead-Free Legislation

Chapter 1: Legislation and Impact on Printed Circuits

Part 2: Printed Circuit Technology Drivers


Chapter 3: Semiconductor Packaging Technology

Chapter 4: Advanced Component Packaging

Chapter 5: Types of Printed Wiring Boards

Part 3: Materials

Chapter 6: Introduction to Base Materials

Chapter 7: Base Material Components

Chapter 8: Properties of Base Materials

Chapter 9: Base Materials Performance Issues

Chapter 10: The Impact of Lead-Free Assembly on Base Materials

Chapter 11: Selecting Base Materials for Lead-Free Assembly Applications

Chapter 12: Laminate Qualification and Testing

Part 4: Engineering and Design

Chapter 13: Physical Characteristics of the PCBM

Chapter 14: The PCB Design Process

Chapter 15: Electrical and Mechanical Design Parameters

Chapter 16: Current Carrying Capacity in Printed Circuits

Chapter 17: PCB Design for Thermal Performance

Chapter 18: Information Formatting and Exchange

Chapter 19: Planning for Design, Fabrication, and Assembly

Chapter 20: Manufacturing Information, Documentation, and Transfer Including CAM Tooling for Fab and Assembly

Chapter 21: Embedded Components

Part 5: High Density Interconnection

Chapter 22: Introduction to High-Density Interconnection (HDI) Technology

Chapter 23: Advanced High-Density Interconnection (HDI) Technologies

Part 6: Fabrication

Chapter 24: Drilling Processes

Chapter 25: Precision Interconnect Drilling

Chapter 26: Imaging

Chapter 27: Multilayer Materials and Processing

Chapter 28: Preparing Boards for Plating

Chapter 29: Electroplating

Chapter 30: Direct Plating

Chapter 31: PWB Manufacture Using Fully Electroless Copper

Chapter 32: Printed Circuit Board Surface Finishes

Chapter 33: Solder Mask

Chapter 34: Etching Process and Technologies

Chapter 35: Machining and Routing

Part 7: Bare Board Test

Chapter 36: Bare Board Test Objectives and Definitions

Chapter 37: Bare Board Test Methods

Chapter 38: Bare Board Test Equipment

Chapter 39: HDI Bare Board Special Testing Methods

Part 8: Assembly

Chapter 40: Assembly Processes

Chapter 41: Conformal Costing

Part 9: Solderability Technology

Chapter 42: Solderability: Incoming Inspection and Wet Balance Technique

Chapter 43: Fluxes and Cleaning

Part 10: Solder Materials and Processes

Chapter 44: Soldering Fundamentals

Chapter 45: Soldering Materials and Metallurgy

Chapter 46: Solder Fluxes

Chapter 47: Soldering Techniques

Chapter 48: Soldering Repair and Rework

Part 11: Nonsolder Interconnection

Chapter 49: Press-Fit Interconnection

Chapter 50: Land Grid Array Interconnect

Part 12: Quality

Chapter 51: Acceptability and Quality of Fabricated Boards

Chapter 52: Acceptability of Printed Circuit Board Assemblies

Chapter 53: Assembly Inspection

Chapter 54: Design for Testing

Chapter 55: Loaded Board Testing

Part 13: Reliability

Chapter 56: Conductive Anodic Filament Formation

Chapter 57: Reliability of Printed Circuit Assemblies

Chapter 58: Component-to-PWB Reliability: The Impact of Design Variables and Lead Free

Chapter 59: Component-to-PWB Reliability: Estimating Solder-Joint Reliability and the Impact of Lead-Free Solders

Part 14: Environmental Issues

Chapter 60: Process Waste Minimization and Treatment

Part 15: Flexible Circuits

Chapter 61: Flexible Circuit Applications and Materials

Chapter 62: Design of Flexible Circuits

Chapter 63: Manufacturing of Flexible Circuits

Chapter 64: Termination of Flexible Circuits

Chapter 65: Multilayer Flex and Rigid/Flex

Chapter 66: Special Constructions of Flexible Circuits

Chapter 67: Quality Assurance of Flexible Circuits




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