Reliability issues are a hot topic in the global electronics industry, and here at last is a precise tutorial on predicting and extending the functional life of semiconductor componentsthe first book on this extremely important subject. Using empirical modeling, Di Giacomo expertly covers all major types of failure mechanisms that can greatly reduce the active life of semiconductor components, including interconnection fatigue and electromigration. He also shows how to use statistical analysis to project failure rates. By cutting across different technologies and materials, this unique text will prove invaluable to engineers in the numerous fields that rely on semiconductor components.
Table of ContentsIntroduction.Packaging. Service Stresses. Field Environment. Test Conditions and Failure Mechanism Acceleration. Early Fails. Wearout Fails. Types of Fail Distributions. Failure Mechanisms and Modeling. Reliability Testing and Statistical Analysis.