Reliability of Electronic Packages and Semiconductor Devices

Reliability of Electronic Packages and Semiconductor Devices

by Giulio Di Giacomo, Giulio Di Giacomo

Hardcover

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Product Details

ISBN-13: 9780070170247
Publisher: McGraw-Hill Professional Publishing
Publication date: 12/01/1996
Series: Electronic Packaging and Interconnection Series
Pages: 410
Product dimensions: 6.23(w) x 9.27(h) x 1.34(d)

Table of Contents

Introduction.Packaging. Service Stresses. Field Environment. Test Conditions and Failure Mechanism Acceleration. Early Fails. Wearout Fails. Types of Fail Distributions. Failure Mechanisms and Modeling. Reliability Testing and Statistical Analysis.

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