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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.The authors use their extensive experience to produce detailed chapters covering temperature, moisture,...