ISBN-10:
079181548X
ISBN-13:
9780791815489
Pub. Date:
01/29/1996
Publisher:
American Society of Mechanical Engineers
Sensing, Modeling and Simulation in Emerging Electronic Packaging: Proceedings ASME International Mechanical Engineering Congress and Exposition, 1996, Atlanta, Georgia

Sensing, Modeling and Simulation in Emerging Electronic Packaging: Proceedings ASME International Mechanical Engineering Congress and Exposition, 1996, Atlanta, Georgia

by Chao-Pin Yeh, Charles Ume

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Overview

Proceedings of the International Mechanical Engineering Congress & Exposition, November 17-22, 1996, Atlanta, Georgia. The 15 papers in this volume represent the modeling, simulation, and sensing technologies used in the merging electronic packaging applications, including flip chip and ball grid array (BGA), with a balanced contribution from industry and academia. By: C.P. Yeh and C. Ume

Product Details

ISBN-13: 9780791815489
Publisher: American Society of Mechanical Engineers
Publication date: 01/29/1996
Series: Eep Series
Pages: 132
Product dimensions: 6.00(w) x 1.25(h) x 9.00(d)

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