Paperback(Softcover reprint of the original 1st ed. 1989)

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Product Details

ISBN-13: 9783662150818
Publisher: Springer Berlin Heidelberg
Publication date: 05/22/2013
Series: Advances in Polymer Science , #88
Edition description: Softcover reprint of the original 1st ed. 1989
Pages: 197
Product dimensions: 6.69(w) x 9.61(h) x 0.02(d)

Table of Contents

Epoxy molding compounds as encapsulation materials for microelectronic devices.- Synthesis and structure of macromolecular topological compounds.- Reactions and photodynamics in polymer solids.- Thermotropic mesophases in element-organic polymers.

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