The proposed book will offer comprehensive and versatilemethodologies and recommendations on how to determine dynamiccharacteristics of typical micro- and opto-electronic structuralelements (printed circuit boards, solder joints, heavy devices,etc.) and how to design a viable and reliable structure that wouldbe able to withstand high-level dynamic loading. Particularattention will be given to portable devices and systems designedfor operation in harsh environments (such as automotive, aerospace,military, etc.) In-depth discussion from a mechanicalengineer's viewpoint will be conducted to the key components’level as well as the whole device level. Both theoretical(analytical and computer-aided) and experimental methods ofanalysis will be addressed. The authors will identify how thefailure control parameters (e.g. displacement, strain and stress)of the vulnerable components may be affected by the externalvibration or shock loading, as well as by the internal parametersof the infrastructure of the device. Guidelines for materialselection, effective protection and test methods will be developedfor engineering practice.
|Product dimensions:||7.60(w) x 9.30(h) x 1.40(d)|
About the Author
Dr. EPHRAIM SUHIR is Fellow of the IEEE, ASME, APS, IoP(UK), and the SPE. He is Foreign Full Member (Academician) of theNational Academy of Engineering, Ukraine; cofounder of the ASMEJournal of Electronic Packaging; holds twenty-two U.S.patents; and has authored about 300 technical publications (papers,book chapters, books). Dr. Suhir has received many professionalawards, including the 2004 ASME Worcester Read Warner Medal foroutstanding contributions to the permanent literature ofengineering; 2001 IMAPS John A. Wagnon Technical Achievement Awardfor outstanding contributions to the technical knowledge of themicroelectronics, optoelectronics, and packaging industry; 2000IEEE-CPMT Outstanding Sustained Technical Contribution Award; 2000SPE International Engineering/Technology Award for contributions toplastics engineering; 1999 ASME Charles Russ Richards MemorialAward for contributions to mechanical engineering; and 1996 BellLaboratories Distinguished Member of Technical Staff Award fordeveloping engineering mechanics methods for predicting thereliability, performance, and mechanical behavior of complexstructures.
DAVID S. STEINBERG is associated with the University ofCalifornia, Los Angeles, Extension and also at the University ofWisconsin-Extension. He retired from Litton GCS (now NorthropGrumman) after serving as their director of engineering. He is theauthor of seven popular textbooks related to the design, analysis,testing, and evaluation of sophisticated electronic equipment forreliable operation in severe vibration, shock, thermal, thermalcycling, acoustic, and pyrotechnic shock environments. His mostpopular textbooks are Vibration Analysis for ElectronicEquipment, Cooling Techniques for Electronic Equipment, andPreventing Thermal Cycling and Vibration Failures in ElectronicEquipment, published by Wiley. Dr. Steinberg is currently thePresident of Steinberg & Associates and has presented seminars,workshops, and consulted for many of the major suppliers ofelectronics components and equipment such as General Electric,General Motors, Intel, Cisco, Texas Instruments, Microsoft, Harris,Honeywell, Raytheon, Westinghouse, and many others.
T. X. YU is Professor Emeritus of Mechanical Engineeringat the Hong Kong University of Science and Technology (HKUST).After graduating from Peking University, he got his PhD and ScDfrom Cambridge University. After teaching at Peking University andUMIST, he joined HKUST in 1995. Before his retirement in July 2010,he was chair professor of mechanical engineering, associatevice-president (R&D), and dean of Fok Ying Tung Graduate Schoolat HKUST. His research interests include impact dynamics,plasticity, energy absorption, textile and cellular materials, andnano-composites. He has published three textbooks, three scientificmonographs, 310 journal papers, 170 international conferencepapers, and four patents. He serves as Associate Editor for theInternational Journal of Impact Engineering and InternationalJournal of Mechanical Sciences. He is a Fellow of ASME, IMechE,and HKIE.
Table of Contents
1 Some Major Structural Dynamics-Related Failure Modes andMechanisms in Micro- and Opto-Electronic Systems and DynamicStability of These Systems (David S. Steinberg).
2 Linear Response to Shocks and Vibrations (EphraimSuhir).
3 Linear and Nonlinear Vibrations Caused by Periodic Impulses(Ephraim Suhir).
4 Random Vibrations of Structural Elements in Electronic andPhotonic Systems (Ephraim Suhir).
5 Natural Frequencies and Failure Mechanisms of Electronic andPhotonic Structures Subjected to Sinusoidal or Random Vibrations(David S. Steinberg).
6 Drop/Impact of Typical Portable Electronic Devices:Experimentation and Modeling (T. X. Yu and C. Y. Zhou).
7 Shock Test Methods and Test Standards for Portable ElectronicDevices (C. Y. Zhou, T. X. Yu, S. W. Ricky Lee, and EphraimSuhir).
8 Dynamic Response of Solder Joint Interconnections to Vibrationand Shock (David S. Steinberg).
9 Test Equipment, Test Methods, Test Fixtures, and Test Sensorsfor Evaluating Electronic Equipment (David S.Steinberg).
10 Correlation between Package-Level High-Speed Solder BallShear/Pull and Board-Level Mechanical Drop Tests with BrittleFracture Failure Mode, Strength, and Energy (Fubin Song, S. W.Ricky Lee, Keith Newman, Bob Sykes, and Stephen Clark).
11 Dynamic Mechanical Properties and Microstructural Studies ofLead-Free Solders in Electronic Packaging (V. B. C. Tan, K. C.Ong, C. T. Lim, and J. E. Field).
12 Fatigue Damage Evaluation for Microelectronic ComponentsSubjected to Vibration (T. E. Wong).
13 Vibration Considerations for Sensitive Research andProduction Facilities (E. E. Ungar, H. Amick, and J. A.Zapfe).
14 Applications of Finite Element Analysis: Attributes andChallenges (Metin Ozen).
15 Shock Simulation of Drop Test of Hard Disk Drives (D. W.Shu, B. J. Shi, and J. Luo).
16 Shock Protection of Portable Electronic Devices Using a“Cushion” of an Array of Wires (AOW) (EphraimSuhir).
17 Board-Level Reliability of Lead-Free Solder under MechanicalShock and Vibration Loads (Toni T. Matilla, Pekka Marjamaki, andJorma Kivilahti).
18 Dynamic Response of PCB Structures to Shock Loading inReliability Tests (Milena Vujosevic and Ephraim Suhir).
19 Linear Response of Single-Degree-of-Freedom System to ImpactLoad: Could Shock Tests Adequately Mimic Drop Test Conditions?(Ephraim Suhir).
20 Shock Isolation of Micromachined Device for High-gApplications (Sang-Hee Yoon, Jin-Eep Roh, and Ki LyugKim).
21 Reliability Assessment of Microelectronics Packages UsingDynamic Testing Methods (X. Q. Shi, G. Y. Li, and Q. J.Yang).
22 Thermal Cycle and Vibration/Drop Reliability of Area ArrayPackage Assemblies (Reza Ghaffarian).
23 Could an Impact Load of Finite Duration Be Substituted withan Instantaneous Impulse? (Ephraim Suhir and LucianoArruda).