Pub. Date:
VDM Verlag
Study Of Snagcu Alloy Reliability

Study Of Snagcu Alloy Reliability

by Krishna TungaKrishna Tunga


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This work aims to understand the reliability of
SnAgCu solder interconnects used in PBGA packages using microstructure evolution, laser moiré
interferometry and finite-element modeling. A
particle coarsening based microstructure evolution of the solder joint material during thermal excursions was studied for extended periods of time lasting for several months. The microstructure evolution and particle coarsening was quantified, and acceleration factors were determined between benign field-use conditions and ATC conditions for PBGA packages with different form factors and for two different lead-free solder alloys. A new technique using laser moiré interferometry was developed to assess the deformation behavior of SnAgCu based solder joints during thermal excursions. This technique can used to estimate the fatigue life of solder joints quickly in a matter of few days instead of months. FEA in conjunction with experimental data from the ATC for different lead-free PBGA packages was used to develop a fatigue life model that can be used to predict solder joint fatigue life for any PBGA package.

Product Details

ISBN-13: 9783639133271
Publisher: VDM Verlag
Publication date: 03/15/2009
Pages: 188
Product dimensions: 0.43(w) x 6.00(h) x 9.00(d)

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