Wafer Bonding: Applications and Technology / Edition 1

Wafer Bonding: Applications and Technology / Edition 1

ISBN-10:
3642059155
ISBN-13:
9783642059155
Pub. Date:
09/30/2011
Publisher:
Springer Berlin Heidelberg
Select a Purchase Option (Softcover reprint of hardcover 1st ed. 2004)
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Overview

Wafer Bonding: Applications and Technology / Edition 1

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Product Details

ISBN-13: 9783642059155
Publisher: Springer Berlin Heidelberg
Publication date: 09/30/2011
Series: Springer Series in Materials Science , #75
Edition description: Softcover reprint of hardcover 1st ed. 2004
Pages: 504
Product dimensions: 6.10(w) x 9.25(h) x 0.04(d)

Table of Contents

1 Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding.- 2 Basics of Silicon-on-Insulator (SOI) Technology.- 3 Silicon-on-Insulator by the Smart CutTM Process.- 4 ELTRAN® Technology Based on Wafer Bonding and Porous Silicon.- 5 Wafer Bonding for High-Performance Logic Applications.- 6 Application of Bonded Wafers to the Fabrication of Electronic Devices.- 7 Compound Semiconductor Heterostructures by Smart CutTM: SiC On Insulator, QUASICTM Substrates, InP and GaAs Heterostructures on Silicon.- 8 Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach.- 9 Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers.- 10 High-Density Hybrid Integration of III–V Compound Optoelectronics with Silicon Integrated Circuits.- 11 Layer Transfer by Bonding and Laser Lift-Off.- 12 Single-Crystal Lithium Niobate Films by Crystal Ion Slicing.- 13 Wafer Bonding of Ferroelectric Materials.- 14 Debonding of Wafer-Bonded Interfaces for Handling and Transfer Applications.

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