The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
|Publisher:||Springer Berlin Heidelberg|
|Series:||Springer Series in Materials Science , #75|
|Edition description:||Softcover reprint of hardcover 1st ed. 2004|
|Product dimensions:||6.10(w) x 9.25(h) x 0.04(d)|
Table of Contents