Wafer Bonding: Applications and Technology / Edition 1

Wafer Bonding: Applications and Technology / Edition 1

ISBN-10:
3642059155
ISBN-13:
9783642059155
Pub. Date:
09/30/2011
Publisher:
Springer Berlin Heidelberg
Select a Purchase Option (Softcover reprint of hardcover 1st ed. 2004)
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    $279.99
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