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Title: VLSI Engineering: Beyond Software Engineering, Author: Tosiyasu Kunii
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VLSI Engineering: Beyond…
by Tosiyasu Kunii (Editor)
#163 in Series
Paperback $49.99
Title: Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10-12, 2007, San Francisco, California, U.S.A., Author: Qinghuang Lin
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Materials, Processes,…
by Qinghuang Lin (Editor), E. Todd Ryan (Editor), Wen-li Wu (Editor), Do Yeung Yoon (Editor)
Explore Series
Paperback $37.00
Title: Ion Implantation and Activation: Volume 3, Author: Kunihiro Suzuki
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Ion Implantation and…
by Kunihiro Suzuki
Explore Series
eBook $49.00