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Title: Advanced Materials for Thermal Management of Electronic Packaging, Author: Xingcun Colin Tong
Title: Advanced Materials for Thermal Management of Electronic Packaging, Author: Xingcun Colin Tong
Title: Advanced Wirebond Interconnection Technology, Author: Shankara K. Prasad
Title: Air Cooling Technology for Electronic Equipment, Author: Sung Jin Kim
Title: Boundary-Scan Interconnect Diagnosis, Author: José T. de Sousa
Title: CAE - CAD and Thermal Management Issues in Electronic Systems: Proceedings, ASME International Mechanical Engineering Congress and Exposition, Dallas, TX, 1997, Author: Dereje Agonafer
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Title: Contamination of Electronic Assemblies, Author: Elissa M. Bumiller
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Title: Electronic Equipment Packaging Technology, Author: Gerald L. Ginsberg
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Title: Electronic Packaging Materials and Their Properties, Author: Michael Pecht
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