Title: Correct Hardware Design and Verification Methods: IFIP WG10.5 Advanced Research Working Conference, CHARME '95, Frankfurt, Germany, October 1995. Proceedings / Edition 1, Author: Paolo Enrico Camurati
Title: Theoretical Foundations of VLSI Design, Author: K. McEvoy
Title: VLSI Technology / Edition 1, Author: Wai-Kai Chen
Title: From Frequency to Time-Average-Frequency: A Paradigm Shift in the Design of Electronic Systems / Edition 1, Author: Liming Xiu
Title: Digital Circuit Boards: Mach 1 GHz / Edition 1, Author: Ralph Morrison
Title: Algorithms for VLSI Design Automation / Edition 1, Author: Sabih H. Gerez
Title: Mixed Analog-digital Vlsi Devices And Technology, Author: Yannis Tsividis
Title: Timing Optimization Through Clock Skew Scheduling / Edition 1, Author: Ivan S. Kourtev
Title: VLSI-SoC: From Systems to Silicon: IFIP TC10/ WG 10.5 Thirteenth International Conference on Very Large Scale Integration of System on Chip (VLSI-SoC2005), October 17-19, 2005, Perth, Australia / Edition 1, Author: Ricardo Reis
Title: Legacy Data: A Structured Methodology for Device Migration in DSM Technology / Edition 1, Author: Pallab Chatterjee
Title: Systematic Design of Analog IP Blocks / Edition 1, Author: Jan Vandenbussche
Title: Power-Constrained Testing of VLSI Circuits: A Guide to the IEEE 1149.4 Test Standard / Edition 1, Author: Nicola Nicolici
Title: Symbolic Simulation Methods for Industrial Formal Verification / Edition 1, Author: Robert B. Jones
Title: Introduction to VLSI Process Engineering, Author: Y. Naka
Title: Verification by Error Modeling: Using Testing Techniques in Hardware Verification / Edition 1, Author: Katarzyna Radecka
Title: VLSI Circuit Design Methodology Demystified: A Conceptual Taxonomy / Edition 1, Author: Liming Xiu
Title: Power Distribution Network Design for VLSI / Edition 1, Author: Qing K. Zhu
Title: Assertion-Based Design / Edition 2, Author: Harry D. Foster
Title: Engineering the CMOS Library: Enhancing Digital Design Kits for Competitive Silicon / Edition 1, Author: David Doman
Title: Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC / Edition 1, Author: Er-Ping Li

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