Mechanics of Solder Alloy Interconnects / Edition 1

by Darrel R. Frear, Steven N. Burchett, Harold S. Morgan, John H. Lau

Overview

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

Product Details

ISBN-13:	9780442015053
Publisher:	Springer US
Publication date:	01/31/1994
Series:	Electrical Engineering
Edition description:	1994
Pages:	418
Product dimensions:	5.98(w) x 9.02(h) x 0.35(d)

Table of Contents

Foreword; Acknowldgement; Introduction: the mechanics of soldere alloy interconnect; Microstructural influences on the mechanical properties of solder; Interfaces and intermetallics; Constitutivemodels; Prediction of solder joint geometry; Life prediction and accelerated testing; Thermomechanical modeling of solder joints - numerical considerations; Applications - through-hole; Surface mount solder joints under thermal, mechanical, and vibration conditions; Index

Editorial Reviews

As the trend toward the increased miniaturization of devices continues, solder interconnects are becoming the limiting factor in the reliability of electronic packages. The authors discuss the basic metallurgy of solder alloys, the constitutive models available for modeling solder interconnects, computational simulations to predict solder joint geometry, and the application of mechanics models to through-hole and surface mount technologies. Each chapter is written as a "stand-alone" resource for a particular aspect of materials and modeling issues. Annotation c. Book News, Inc., Portland, OR (booknews.com)

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