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Title: Electronic Packaging Materials and Their Properties, Author: Michael Pecht
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Electronic Packaging Materials…
by Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour
#4 in Series
Hardcover $210.00
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan, Author: K. Otsuka
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Multilayer Ceramic Substrate -…
by K. Otsuka
Explore Series
Hardcover $329.99
Title: Thermal Stress and Strain in Microelectronics Packaging, Author: John Lau
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Thermal Stress and Strain in…
by John Lau (Editor)
Paperback $169.99
Title: Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling, Author: Yong Liu
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Power Electronic Packaging:…
by Yong Liu
Hardcover $279.99
Title: Advanced Materials for Thermal Management of Electronic Packaging, Author: Xingcun Colin Tong
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Advanced Materials for Thermal…
by Xingcun Colin Tong
#30 in Series
Hardcover $279.99
Title: Failure Modes and Mechanisms in Electronic Packages, Author: P. Singh
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Failure Modes and Mechanisms…
by P. Singh, Puligandla Viswanadham
Hardcover $169.99

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