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Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
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Handbook Of Electronics…
by Bernard S. Matisoff
Paperback $54.99
Title: The Electronics Assembly Handbook, Author: Frank Riley
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The Electronics Assembly…
by Frank Riley (Editor), Electronic Packaging and Production (Editor)
Paperback $199.99
Title: Electronics Packaging Forum: Volume Two, Author: James E. Morris
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Electronics Packaging Forum:…
by James E. Morris
Paperback $54.99
Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
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Handbook Of Electronics…
by Bernard S. Matisoff
Paperback $54.99
Title: Contamination of Electronic Assemblies, Author: Elissa M. Bumiller
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Contamination of Electronic…
by Elissa M. Bumiller, David A. Douthit, Joan Pecht
eBook $86.99
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan, Author: K. Otsuka
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Multilayer Ceramic Substrate -…
by K. Otsuka
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Hardcover $329.99
Title: The Basics of Soldering, Author: Armin Rahn
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The Basics of Soldering
by Armin Rahn
Hardcover $312.95
Title: Guidebook for Managing Silicon Chip Reliability, Author: Michael Pecht
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Guidebook for Managing Silicon…
by Michael Pecht, Riko Radojcic, Gopal Rao
#5 in Series
Hardcover $140.00
Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications, Author: Dean L. Monthei
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Package Electrical Modeling,…
by Dean L. Monthei
#2 in Series
Hardcover $109.99
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
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Influence of Temperature on…
by Pradeep Lall, Michael Pecht, Edward B. Hakim
eBook $54.99
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, Author: Karl J. Puttlitz
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Handbook of Lead-Free Solder…
by Karl J. Puttlitz, Kathleen A. Stalter
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eBook $525.00
Title: Mechanical Analysis of Electronic Packaging Systems, Author: Stephen A. McKeown
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Mechanical Analysis of…
by Stephen A. McKeown
eBook $86.99
Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability, Author: Michael G. Pecht
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Integrated Circuit, Hybrid,…
by Michael G. Pecht
Hardcover $212.95
Title: Chip On Board: Technology for Multichip Modules, Author: John H. Lau
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Chip On Board: Technology for…
by John H. Lau
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Hardcover $219.99
Title: High Temperature Electronics, Author: F. Patrick McCluskey
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High Temperature Electronics
by F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski
eBook $86.99
Title: Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact, Author: Katsuaki Suganuma
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Lead-Free Soldering in…
by Katsuaki Suganuma
eBook $240.00
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004, Author: S. Kakaï
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Microscale Heat Transfer -…
by S. Kakaï (Editor), L.L. Vasiliev (Editor), Y. Bayazitoglu (Editor), Y. Yener (Editor)
#193 in Series
Paperback $329.99
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability, Author: James J. Licari
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Adhesives Technology for…
by James J. Licari, Dale W. Swanson
Explore Series
eBook $199.00
Title: Soldering Processes and Equipment, Author: Michael G. Pecht
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Soldering Processes and…
by Michael G. Pecht (Editor)
Hardcover $177.95
Title: High-Frequency Characterization of Electronic Packaging, Author: Luc Martens
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High-Frequency…
by Luc Martens
#1 in Series
Hardcover $109.99

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