Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability, Author: Michael G. Pecht
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: High Temperature Electronics, Author: F. Patrick McCluskey
Title: High Temperature Electronics, Author: F. Patrick McCluskey
Title: High Temperature Electronics, Author: F. Patrick McCluskey
Title: Heat Transfer: Thermal Management of Electronics, Author: Younes Shabany
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, Author: Karl J. Puttlitz
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, Author: Karl J. Puttlitz
Title: Handbook of Electronic Package Design, Author: Michael Pecht
Title: Guidebook for Managing Silicon Chip Reliability, Author: Michael Pecht
Title: Guidebook for Managing Silicon Chip Reliability, Author: Michael Pecht
Title: Guidebook for Managing Silicon Chip Reliability, Author: Michael Pecht
Title: Electronic Packaging Materials and Their Properties, Author: Michael Pecht
Title: Electronic Packaging Materials and Their Properties, Author: Michael Pecht
Title: Electronic Packaging and Interconnection Handbook, Author: Charles A. Harper
Title: Contamination of Electronic Assemblies, Author: Elissa M. Bumiller
Title: Contamination of Electronic Assemblies, Author: Elissa M. Bumiller
Title: Contamination of Electronic Assemblies, Author: Elissa M. Bumiller

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