Title: Contamination of Electronic Assemblies, Author: Elissa M. Bumiller
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: Soldering Processes and Equipment, Author: Michael G. Pecht
Title: Handbook of Electronic Package Design, Author: Michael Pecht
Title: Electronic Packaging and Interconnection Handbook, Author: Charles A. Harper
Title: Heat Transfer: Thermal Management of Electronics, Author: Younes Shabany
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing, Author: Shen Liu
Title: Electronic Packaging Materials and Their Properties, Author: Michael Pecht
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
Title: Guidebook for Managing Silicon Chip Reliability, Author: Michael Pecht
Title: Contamination of Electronic Assemblies, Author: Elissa M. Bumiller
Title: Thermal Design of Electronic Equipment, Author: Ralph Remsburg
Title: Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact, Author: Katsuaki Suganuma
Title: Run-to-Run Control in Semiconductor Manufacturing, Author: James Moyne
Title: Mechanical Analysis of Electronic Packaging Systems, Author: Stephen A. McKeown
Title: The Electronic Packaging Handbook, Author: Glenn R. Blackwell
Title: High Temperature Electronics, Author: F. Patrick McCluskey
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: Guidebook for Managing Silicon Chip Reliability, Author: Michael Pecht
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia

Pagination Links