Title: Thermal Design of Electronic Equipment, Author: Ralph Remsburg
Title: The Handbook of Machine Soldering: SMT and TH, Author: Ralph W. Woodgate
Title: The Electronic Packaging Handbook, Author: Glenn R. Blackwell
Title: The Basics of Soldering, Author: Armin Rahn
Title: Soldering Processes and Equipment, Author: Michael G. Pecht
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
Title: Mechanical Analysis of Electronic Packaging Systems, Author: Stephen A. McKeown
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing, Author: Shen Liu
Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability, Author: Michael G. Pecht
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: High Temperature Electronics, Author: F. Patrick McCluskey
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, Author: Karl J. Puttlitz
Title: Guidebook for Managing Silicon Chip Reliability, Author: Michael Pecht
Title: Electronic Packaging Materials and Their Properties, Author: Michael Pecht
Title: Electronic Packaging and Interconnection Handbook, Author: Charles A. Harper
Title: Contamination of Electronic Assemblies, Author: Elissa M. Bumiller
Title: Air Cooling Technology for Electronic Equipment, Author: Sung Jin Kim