Title: The Electronic Packaging Handbook, Author: Glenn R. Blackwell
Title: High Temperature Electronics, Author: F. Patrick McCluskey
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: Electronic Packaging and Interconnection Handbook, Author: Charles A. Harper
Title: Electronic Packaging Materials and Their Properties, Author: Michael Pecht
Title: Failure Modes and Mechanisms in Electronic Packages, Author: P. Singh
Title: Electronic Equipment Packaging Technology, Author: Gerald L. Ginsberg
Title: Soldering Processes and Equipment, Author: Michael G. Pecht
Title: Advanced Materials for Thermal Management of Electronic Packaging, Author: Xingcun Colin Tong
Title: Physical Design for Multichip Modules, Author: Mysore Sriram
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004, Author: S. Kakaï
Title: Contamination of Electronic Assemblies, Author: Elissa M. Bumiller
Title: MCM C/Mixed Technologies and Thick Film Sensors, Author: W.K. Jones
Title: Guidebook for Managing Silicon Chip Reliability, Author: Michael Pecht
Title: The Handbook of Machine Soldering: SMT and TH, Author: Ralph W. Woodgate
Title: Chip On Board: Technology for Multichip Modules, Author: John H. Lau
Title: Handbook Of Tape Automated Bonding, Author: John H. Lau
Title: High-Frequency Characterization of Electronic Packaging, Author: Luc Martens
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing, Author: Shen Liu
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, Author: Karl J. Puttlitz

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