Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications, Author: Dean L. Monthei
Title: High-Frequency Characterization of Electronic Packaging, Author: Luc Martens
Title: Manufacturing Challenges in Electronic Packaging, Author: Y.C. Lee
Title: Electronic Equipment Packaging Technology, Author: Gerald L. Ginsberg
Title: Guidebook for Managing Silicon Chip Reliability, Author: Michael Pecht
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: Physical Design for Multichip Modules, Author: Mysore Sriram
Title: Failure Modes and Mechanisms in Electronic Packages, Author: P. Singh
Title: Electronic Packaging for High Reliability, Low Cost Electronics, Author: R.R. Tummala
Title: Soldering Processes and Equipment, Author: Michael G. Pecht
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing, Author: Shen Liu
Title: Electronic Packaging Materials and Their Properties, Author: Michael Pecht
Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability, Author: Michael G. Pecht
Title: The Handbook of Machine Soldering: SMT and TH, Author: Ralph W. Woodgate
Title: Chip On Board: Technology for Multichip Modules, Author: John H. Lau
Title: Handbook Of Tape Automated Bonding, Author: John H. Lau
Title: MCM C/Mixed Technologies and Thick Film Sensors, Author: W.K. Jones
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
Title: High Temperature Electronics, Author: F. Patrick McCluskey
Title: Electronic Packaging and Interconnection Handbook, Author: Charles A. Harper

Pagination Links