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Title: Materials for High-Density Electronic Packaging and Interconnection, Author: National Research Council
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Materials for High-Density…
by National Research Council, Division on Engineering and Physical Sciences, National Materials Advisory Board, Commission on Engineering and Technical Systems, Committee on Materials for High-Density Electronic Packaging
Paperback $48.00
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
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Influence of Temperature on…
by Pradeep Lall, Michael Pecht, Edward B. Hakim
Paperback $54.99
Title: Electronics Packaging Forum: Volume Two, Author: James E. Morris
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Electronics Packaging Forum:…
by James E. Morris
Paperback $54.99
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
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Influence of Temperature on…
by Pradeep Lall, Michael Pecht, Edward B. Hakim
eBook $54.99
Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
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Handbook Of Electronics…
by Bernard S. Matisoff
Paperback $54.99
Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
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Handbook Of Electronics…
by Bernard S. Matisoff
Paperback $54.99
Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging, Author: Xing-Chang Wei
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Modeling and Design of…
by Xing-Chang Wei
Paperback $59.99
Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging, Author: Xing-Chang Wei
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Modeling and Design of…
by Xing-Chang Wei
eBook $59.99
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
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Practical Guide to the…
by Ali Jamnia
eBook $64.99
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
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Practical Guide to the…
by Ali Jamnia
Paperback $64.99
Title: CAE - CAD and Thermal Management Issues in Electronic Systems: Proceedings, ASME International Mechanical Engineering Congress and Exposition, Dallas, TX, 1997, Author: Dereje Agonafer
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CAE - CAD and Thermal…
by Dereje Agonafer (Editor)
Explore Series
Paperback $72.00
Title: Air Cooling Technology for Electronic Equipment, Author: Sung Jin Kim
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Air Cooling Technology for…
by Sung Jin Kim (Editor), Sang Woo Lee (Editor)
eBook $82.99
Title: Mechanical Analysis of Electronic Packaging Systems, Author: Stephen A. McKeown
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Mechanical Analysis of…
by Stephen A. McKeown
eBook $86.99
Title: Contamination of Electronic Assemblies, Author: Elissa M. Bumiller
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Contamination of Electronic…
by Elissa M. Bumiller, David A. Douthit, Joan Pecht
Explore Series
Paperback $86.99
Title: Contamination of Electronic Assemblies, Author: Elissa M. Bumiller
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Contamination of Electronic…
by Elissa M. Bumiller, David A. Douthit, Joan Pecht
eBook $86.99
Title: High Temperature Electronics, Author: F. Patrick McCluskey
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High Temperature Electronics
by F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski
eBook $86.99
Title: High Temperature Electronics, Author: F. Patrick McCluskey
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High Temperature Electronics
by F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski
Paperback $86.99
Title: Mechanical Analysis of Electronic Packaging Systems, Author: Stephen A. McKeown
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Mechanical Analysis of…
by Stephen A. McKeown
Paperback $86.99
Title: Electronic Equipment Packaging Technology, Author: Gerald L. Ginsberg
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Electronic Equipment Packaging…
by Gerald L. Ginsberg
Hardcover $109.99
Title: High-Frequency Characterization of Electronic Packaging, Author: Luc Martens
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High-Frequency…
by Luc Martens
#1 in Series
Hardcover $109.99

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