Materials for High-Density Electronic Packaging and Interconnection
1128092518
Materials for High-Density Electronic Packaging and Interconnection
48.0 In Stock

Paperback

$48.00 
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Product Details

ISBN-13: 9780309042338
Publisher: National Academies Press
Publication date: 02/01/1990
Pages: 156
Product dimensions: 8.50(w) x 11.00(h) x (d)
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