Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach / Edition 1, Author: Pradeep Lall
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
Title: Electronics Packaging Forum: Volume Two, Author: James E. Morris
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
Title: Laser Diode Chip and Packaging Technology, Author: Pei C. Chen
Title: CAE - CAD and Thermal Management Issues in Electronic Systems: Proceedings, ASME International Mechanical Engineering Congress and Exposition, Dallas, TX, 1997, Author: Dereje Agonafer
Title: Guidebook for Managing Silicon Chip Reliability, Author: Michael Pecht
Title: Air Cooling Technology for Electronic Equipment, Author: Sung Jin Kim
Title: Air Cooling Technology for Electronic Equipment / Edition 1, Author: Sung Jin Kim
Title: High Temperature Electronics, Author: F. Patrick McCluskey
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
Title: Mechanical Analysis of Electronic Packaging Systems, Author: Stephen A. McKeown
Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Stephen A. McKeown
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: Contamination of Electronic Assemblies, Author: Elissa M. Bumiller
Title: Manufacturing Challenges in Electronic Packaging / Edition 1, Author: Y.C. Lee
Title: High-Frequency Characterization of Electronic Packaging / Edition 1, Author: Luc Martens

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