Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
Title: Mechanical Analysis of Electronic Packaging Systems, Author: Stephen A. McKeown
Title: Physical Design for Multichip Modules, Author: Mysore Sriram
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, Author: Karl J. Puttlitz
Title: The Handbook of Machine Soldering: SMT and TH, Author: Ralph W. Woodgate
Title: Boundary-Scan Interconnect Diagnosis, Author: José T. de Sousa
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling, Author: Yong Liu
Title: Electronic Equipment Packaging Technology, Author: Gerald L. Ginsberg
Title: Failure Modes and Mechanisms in Electronic Packages, Author: P. Singh
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing, Author: Shen Liu
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004, Author: S. Kakaï
Title: Advanced Materials for Thermal Management of Electronic Packaging, Author: Xingcun Colin Tong
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
Title: The Electronic Packaging Handbook, Author: Glenn R. Blackwell
Title: Contamination of Electronic Assemblies, Author: Elissa M. Bumiller
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
Title: Thermal Stress and Strain in Microelectronics Packaging, Author: John Lau

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