61- 66 of 66 results
Grid View Grid
List View List
Grid View Grid
List View List
Title: Soldering Processes and Equipment, Author: Michael G. Pecht
QUICK ADD
Soldering Processes and…
by Michael G. Pecht (Editor)
Hardcover $177.95
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan, Author: K. Otsuka
QUICK ADD
Multilayer Ceramic Substrate -…
by K. Otsuka
Explore Series
Hardcover $329.99
Title: The Basics of Soldering, Author: Armin Rahn
QUICK ADD
The Basics of Soldering
by Armin Rahn
Hardcover $312.95
Title: Electronic Equipment Packaging Technology, Author: Gerald L. Ginsberg
QUICK ADD
Electronic Equipment Packaging…
by Gerald L. Ginsberg
Hardcover $109.99
Title: Handbook Of Tape Automated Bonding, Author: John H. Lau
QUICK ADD
Handbook Of Tape Automated…
by John H. Lau
Hardcover $219.99
Title: Materials for High-Density Electronic Packaging and Interconnection, Author: National Research Council
QUICK ADD
Materials for High-Density…
by National Research Council, Division on Engineering and Physical Sciences, National Materials Advisory Board, Commission on Engineering and Technical Systems, Committee on Materials for High-Density Electronic Packaging
Paperback $48.00

Pagination Links