Title: The Electronic Packaging Handbook, Author: Glenn R. Blackwell
Title: High Temperature Electronics, Author: F. Patrick McCluskey
Title: High Temperature Electronics, Author: F. Patrick McCluskey
Title: Electronic Packaging Materials and Their Properties, Author: Michael Pecht
Title: Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact, Author: Katsuaki Suganuma
Title: High-Frequency Characterization of Electronic Packaging, Author: Luc Martens
Title: Contamination of Electronic Assemblies, Author: Elissa M. Bumiller
Title: Run-to-Run Control in Semiconductor Manufacturing, Author: James Moyne
Title: Physical Design for Multichip Modules, Author: Mysore Sriram
Title: MCM C/Mixed Technologies and Thick Film Sensors, Author: W.K. Jones
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: Air Cooling Technology for Electronic Equipment, Author: Sung Jin Kim
Title: MCM C/Mixed Technologies and Thick Film Sensors, Author: W.K. Jones
Title: Manufacturing Challenges in Electronic Packaging, Author: Y.C. Lee
Title: Guidebook for Managing Silicon Chip Reliability, Author: Michael Pecht
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability, Author: James J. Licari
Title: Thermal Design of Electronic Equipment, Author: Ralph Remsburg
Title: Soldering Processes and Equipment, Author: Michael G. Pecht
Title: The Basics of Soldering, Author: Armin Rahn
Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability, Author: Michael G. Pecht

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