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Title: MCM C/Mixed Technologies and Thick Film Sensors, Author: W.K. Jones
Title: Electronic Packaging for High Reliability, Low Cost Electronics, Author: R.R. Tummala
Title: Handbook of Electronic Package Design, Author: Michael Pecht
Title: Manufacturing Challenges in Electronic Packaging, Author: Y.C. Lee
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
Title: Boundary-Scan Interconnect Diagnosis, Author: José T. de Sousa
Title: High Temperature Electronics, Author: F. Patrick McCluskey
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability, Author: James J. Licari
Title: Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling, Author: Yong Liu
Title: The Handbook of Machine Soldering: SMT and TH, Author: Ralph W. Woodgate
Title: Electronic Packaging and Interconnection Handbook, Author: Charles A. Harper
Title: Thermal Stress and Strain in Microelectronics Packaging, Author: John Lau
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Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing, Author: Shen Liu
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
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Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
Title: Mechanical Analysis of Electronic Packaging Systems, Author: Stephen A. McKeown

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