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Title: Handbook Of Tape Automated Bonding, Author: John H. Lau
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Handbook Of Tape Automated…
by John H. Lau
Hardcover $219.99
Title: High-Frequency Characterization of Electronic Packaging, Author: Luc Martens
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High-Frequency…
by Luc Martens
#1 in Series
Hardcover $109.99
Title: Thermal Stress and Strain in Microelectronics Packaging, Author: John Lau
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Thermal Stress and Strain in…
by John Lau (Editor)
Paperback $169.99
Title: Contamination of Electronic Assemblies, Author: Elissa M. Bumiller
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Contamination of Electronic…
by Elissa M. Bumiller, David A. Douthit, Joan Pecht
eBook $86.99
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing, Author: Shen Liu
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LED Packaging for Lighting…
by Shen Liu, Xiaobing Luo
Hardcover $179.95
Title: The Electronic Packaging Handbook, Author: Glenn R. Blackwell
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The Electronic Packaging…
by Glenn R. Blackwell (Editor)
Explore Series
eBook $300.00
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, Author: Karl J. Puttlitz
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Handbook of Lead-Free Solder…
by Karl J. Puttlitz, Kathleen A. Stalter
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Hardcover $525.00
Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
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Handbook Of Electronics…
by Bernard S. Matisoff
Paperback $54.99
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, Author: Karl J. Puttlitz
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Handbook of Lead-Free Solder…
by Karl J. Puttlitz, Kathleen A. Stalter
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eBook $525.00
Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging, Author: Xing-Chang Wei
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Modeling and Design of…
by Xing-Chang Wei
Paperback $59.99
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
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Practical Guide to the…
by Ali Jamnia
Hardcover $220.00
Title: High Temperature Electronics, Author: F. Patrick McCluskey
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High Temperature Electronics
by F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski
eBook $86.99
Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability, Author: Michael G. Pecht
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Integrated Circuit, Hybrid,…
by Michael G. Pecht
Hardcover $212.95
Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging, Author: Xing-Chang Wei
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Modeling and Design of…
by Xing-Chang Wei
eBook $59.99
Title: Handbook of Electronic Package Design, Author: Michael Pecht
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Handbook of Electronic Package…
by Michael Pecht
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eBook $550.00
Title: Electronic Packaging for High Reliability, Low Cost Electronics, Author: R.R. Tummala
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Electronic Packaging for High…
by R.R. Tummala (Editor), Marija Kosec (Editor), W.K. Jones (Editor), Darko Belavic (Editor)
#57 in Series
Hardcover $169.99
Title: High Temperature Electronics, Author: F. Patrick McCluskey
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High Temperature Electronics
by F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski
Paperback $86.99
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan, Author: K. Otsuka
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Multilayer Ceramic Substrate -…
by K. Otsuka
Explore Series
Hardcover $329.99
Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications, Author: Dean L. Monthei
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Package Electrical Modeling,…
by Dean L. Monthei
#2 in Series
Hardcover $109.99
Title: Mechanical Analysis of Electronic Packaging Systems, Author: Stephen A. McKeown
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Mechanical Analysis of…
by Stephen A. McKeown
Paperback $86.99

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