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Title: Electronic Packaging and Interconnection Handbook / Edition 4, Author: Charles A. Harper
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Electronic Packaging and…
by Charles A. Harper
Hardcover $250.00
Title: Hermeticity of Electronic Packages / Edition 2, Author: Hal Greenhouse
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Hermeticity of Electronic…
by Hal Greenhouse
Hardcover $199.00
Title: Thermal Design of Electronic Equipment / Edition 1, Author: Ralph Remsburg
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Thermal Design of Electronic…
by Ralph Remsburg
#10 in Series
Hardcover $240.00
Title: Electronic Packaging Materials and Their Properties / Edition 1, Author: Michael Pecht
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Electronic Packaging Materials…
by Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour
#4 in Series
Hardcover $210.00
Title: Manufacturing Challenges in Electronic Packaging / Edition 1, Author: Y.C. Lee
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Manufacturing Challenges in…
by Y.C. Lee, W.T. Chen
Hardcover $109.99
Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications / Edition 1, Author: Dean L. Monthei
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Package Electrical Modeling,…
by Dean L. Monthei
#2 in Series
Hardcover $109.99
Title: The Basics of Soldering / Edition 1, Author: Armin Rahn
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The Basics of Soldering /…
by Armin Rahn
Hardcover $312.95
Title: Air Cooling Technology for Electronic Equipment / Edition 1, Author: Sung Jin Kim
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Air Cooling Technology for…
by Sung Jin Kim, Sang Woo Lee
Hardcover $82.99
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004 / Edition 1, Author: S. Kakaï
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Microscale Heat Transfer -…
by S. Kakaï, L.L. Vasiliev, Y. Bayazitoglu, Y. Yener
#193 in Series
Hardcover $329.99
Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability / Edition 1, Author: Michael G. Pecht
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Integrated Circuit, Hybrid,…
by Michael G. Pecht
Hardcover $212.95
Title: Advanced Materials for Thermal Management of Electronic Packaging / Edition 1, Author: Xingcun Colin Tong
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Advanced Materials for Thermal…
by Xingcun Colin Tong
#30 in Series
Hardcover $279.99
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
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High Temperature Electronics /…
by F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski
Explore Series
Hardcover $240.00
Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging / Edition 1, Author: Xing-Chang Wei
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Modeling and Design of…
by Xing-Chang Wei
Hardcover $160.00
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing / Edition 1, Author: Shen Liu
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LED Packaging for Lighting…
by Shen Liu, Xiaobing Luo
Hardcover $179.95
Title: Failure Modes and Mechanisms in Electronic Packages / Edition 1, Author: P. Singh
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Failure Modes and Mechanisms…
by P. Singh, Puligandla Viswanadham
Hardcover $169.99
Title: Handbook Of Tape Automated Bonding / Edition 1, Author: John H. Lau
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Handbook Of Tape Automated…
by John H. Lau
Hardcover $219.99
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan / Edition 1, Author: K. Otsuka
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Multilayer Ceramic Substrate -…
by K. Otsuka
Explore Series
Hardcover $329.99
Title: Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling / Edition 1, Author: Yong Liu
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Power Electronic Packaging:…
by Yong Liu
Hardcover $279.99
Title: Electronic Packaging for High Reliability, Low Cost Electronics, Author: R.R. Tummala
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Electronic Packaging for High…
by R.R. Tummala (Editor), Marija Kosec (Editor), W.K. Jones (Editor), Darko Belavic (Editor)
#57 in Series
Hardcover $169.99
Title: Physical Design for Multichip Modules / Edition 1, Author: Mysore Sriram
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Physical Design for Multichip…
by Mysore Sriram, Sung-Mo (Steve) Kang
#267 in Series
Hardcover $169.99

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