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Title: High-Frequency Characterization of Electronic Packaging, Author: Luc Martens
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High-Frequency…
by Luc Martens
#1 in Series
Hardcover $109.99
Title: The Handbook of Machine Soldering: SMT and TH, Author: Ralph W. Woodgate
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The Handbook of Machine…
by Ralph W. Woodgate
Explore Series
Hardcover $218.95
Title: High Temperature Electronics, Author: F. Patrick McCluskey
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High Temperature Electronics
by F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski
Explore Series
Hardcover $255.00
Title: Electronic Equipment Packaging Technology, Author: Gerald L. Ginsberg
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Electronic Equipment Packaging…
by Gerald L. Ginsberg
Hardcover $109.99
Title: Electronic Packaging and Interconnection Handbook, Author: Charles A. Harper
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Electronic Packaging and…
by Charles A. Harper
Hardcover $250.00
Title: The Basics of Soldering, Author: Armin Rahn
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The Basics of Soldering
by Armin Rahn
Hardcover $312.95
Title: Advanced Wirebond Interconnection Technology, Author: Shankara K. Prasad
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Advanced Wirebond…
by Shankara K. Prasad
Hardcover $329.99
Title: Handbook Of Tape Automated Bonding, Author: John H. Lau
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Handbook Of Tape Automated…
by John H. Lau
Hardcover $219.99
Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability, Author: Michael G. Pecht
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Integrated Circuit, Hybrid,…
by Michael G. Pecht
Hardcover $212.95
Title: Soldering Processes and Equipment, Author: Michael G. Pecht
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Soldering Processes and…
by Michael G. Pecht (Editor)
Hardcover $177.95
Title: Chip On Board: Technology for Multichip Modules, Author: John H. Lau
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Chip On Board: Technology for…
by John H. Lau
Explore Series
Hardcover $219.99

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