Title: Air Cooling Technology for Electronic Equipment / Edition 1, Author: Sung Jin Kim
Title: Manufacturing Challenges in Electronic Packaging / Edition 1, Author: Y.C. Lee
Title: High-Frequency Characterization of Electronic Packaging / Edition 1, Author: Luc Martens
Title: Electronic Equipment Packaging Technology / Edition 1, Author: Gerald L. Ginsberg
Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications / Edition 1, Author: Dean L. Monthei
Title: Fundamentals and Essentials of Electronic Packaging, Author: Puligandla Viswanadham
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
Title: Electronic Packaging for High Reliability, Low Cost Electronics, Author: R.R. Tummala
Title: Physical Design for Multichip Modules / Edition 1, Author: Mysore Sriram
Title: Failure Modes and Mechanisms in Electronic Packages / Edition 1, Author: P. Singh
Title: Soldering Processes and Equipment / Edition 1, Author: Michael G. Pecht
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing / Edition 1, Author: Shen Liu
Title: Hermeticity of Electronic Packages / Edition 2, Author: Hal Greenhouse
Title: Electronic Packaging Materials and Their Properties / Edition 1, Author: Michael Pecht
Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability / Edition 1, Author: Michael G. Pecht
Title: The Handbook of Machine Soldering: SMT and TH / Edition 3, Author: Ralph W. Woodgate
Title: MCM C/Mixed Technologies and Thick Film Sensors / Edition 1, Author: W.K. Jones
Title: Chip On Board: Technology for Multichip Modules / Edition 1, Author: John H. Lau
Title: Handbook Of Tape Automated Bonding / Edition 1, Author: John H. Lau
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition / Edition 3, Author: Ali Jamnia

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