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Title: Soldering Processes and Equipment, Author: Michael G. Pecht
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Soldering Processes and…
by Michael G. Pecht (Editor)
Hardcover $177.95
Title: Physical Design for Multichip Modules, Author: Mysore Sriram
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Physical Design for Multichip…
by Mysore Sriram, Sung-Mo (Steve) Kang
#267 in Series
Hardcover $169.99
Title: Electronic Packaging for High Reliability, Low Cost Electronics, Author: R.R. Tummala
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Electronic Packaging for High…
by R.R. Tummala (Editor), Marija Kosec (Editor), W.K. Jones (Editor), Darko Belavic (Editor)
#57 in Series
Hardcover $169.99
Title: Failure Modes and Mechanisms in Electronic Packages, Author: P. Singh
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Failure Modes and Mechanisms…
by P. Singh, Puligandla Viswanadham
Hardcover $169.99
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
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Influence of Temperature on…
by Pradeep Lall, Michael Pecht, Edward B. Hakim
Explore Series
Hardcover $165.00
Title: Guidebook for Managing Silicon Chip Reliability, Author: Michael Pecht
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Guidebook for Managing Silicon…
by Michael Pecht, Riko Radojcic, Gopal Rao
#5 in Series
Hardcover $150.00
Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications, Author: Dean L. Monthei
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Package Electrical Modeling,…
by Dean L. Monthei
#2 in Series
Hardcover $109.99
Title: Manufacturing Challenges in Electronic Packaging, Author: Y.C. Lee
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Manufacturing Challenges in…
by Y.C. Lee (Editor), W.T. Chen (Editor)
Hardcover $109.99
Title: High-Frequency Characterization of Electronic Packaging, Author: Luc Martens
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High-Frequency…
by Luc Martens
#1 in Series
Hardcover $109.99
Title: Electronic Equipment Packaging Technology, Author: Gerald L. Ginsberg
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Electronic Equipment Packaging…
by Gerald L. Ginsberg
Hardcover $109.99
Title: Air Cooling Technology for Electronic Equipment, Author: Sung Jin Kim
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Air Cooling Technology for…
by Sung Jin Kim (Editor), Sang Woo Lee (Editor)
Hardcover $87.99

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