Title: The Electronics Assembly Handbook, Author: Frank Riley
Title: Fundamentals and Essentials of Electronic Packaging, Author: Puligandla Viswanadham
Title: Electronic Packaging and Interconnection Handbook / Edition 4, Author: Charles A. Harper
Title: Heat Transfer: Thermal Management of Electronics, Author: Younes Shabany
Title: Mechanical Analysis of Electronic Packaging Systems, Author: Stephen A. McKeown
Title: The Handbook of Machine Soldering: SMT and TH / Edition 3, Author: Ralph W. Woodgate
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: Electronic Packaging Materials and Their Properties, Author: Michael Pecht
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, Author: Karl J. Puttlitz
Title: Advanced Materials for Thermal Management of Electronic Packaging / Edition 1, Author: Xingcun Colin Tong
Title: Run-to-Run Control in Semiconductor Manufacturing, Author: James Moyne
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
Title: Advanced Wirebond Interconnection Technology / Edition 1, Author: Shankara K. Prasad
Title: Hermeticity of Electronic Packages, Author: Hal Greenhouse
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing / Edition 1, Author: Shen Liu
Title: Chip On Board: Technology for Multichip Modules / Edition 1, Author: John H. Lau
Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing, Author: Shen Liu
Title: Boundary-Scan Interconnect Diagnosis / Edition 1, Author: José T. de Sousa

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