Title: Handbook Of Tape Automated Bonding / Edition 1, Author: John H. Lau
Title: Thermal Design of Electronic Equipment, Author: Ralph Remsburg
Title: Manufacturing Challenges in Electronic Packaging / Edition 1, Author: Y.C. Lee
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004 / Edition 1, Author: S. Kakaï
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing / Edition 1, Author: Shen Liu
Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004 / Edition 1, Author: S. Kakaï
Title: Thermal Stress and Strain in Microelectronics Packaging, Author: John Lau
Title: High-Frequency Characterization of Electronic Packaging / Edition 1, Author: Luc Martens
Title: Electronic Packaging Materials and Their Properties, Author: Michael Pecht
Title: Fundamentals and Essentials of Electronic Packaging, Author: Puligandla Viswanadham
Title: The Electronic Packaging Handbook, Author: Glenn R. Blackwell
Title: The Electronic Packaging Handbook / Edition 1, Author: Glenn R. Blackwell
Title: CAE - CAD and Thermal Management Issues in Electronic Systems: Proceedings, ASME International Mechanical Engineering Congress and Exposition, Dallas, TX, 1997, Author: Dereje Agonafer
Title: Heat Transfer: Thermal Management of Electronics, Author: Younes Shabany
Title: Soldering Processes and Equipment / Edition 1, Author: Michael G. Pecht
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
Title: Laser Diode Chip and Packaging Technology, Author: Pei C. Chen
Title: Chip On Board: Technology for Multichip Modules / Edition 1, Author: John H. Lau
Title: The Basics of Soldering / Edition 1, Author: Armin Rahn

Pagination Links