Title: PCB Design for Real-World EMI Control, Author: Bruce R. Archambeault
Title: Power Systems-On-Chip: Practical Aspects of Design, Author: Bruno Allard
Title: Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly, Author: Jennie S. Hwang
Title: PCB Currents: How They Flow, How They React, Author: Douglas Brooks
Title: Structural Analysis of Printed Circuit Board Systems, Author: Peter A. Engel
Title: Printed Organic and Molecular Electronics, Author: Daniel R. Gamota
Title: Analog and Mixed-Signal Boundary-Scan: A Guide to the IEEE 1149.4 Test Standard, Author: Adam Osseiran
Title: The Boundary-Scan Handbook, Author: Kenneth P. Parker
Title: Printed circuit board assembly: The Complete Works, Author: P.J.W. Noble
Title: Boundary-Scan Test: A Practical Approach, Author: Harry Bleeker
Title: Printed Resonant Periodic Structures and Their Applications, Author: Mahesh Abegaonkar
Title: Soldering Handbook For Printed Circuits and Surface Mounting, Author: Howard H. Manko
Title: The Boundary - Scan Handbook, Author: Kenneth P. Parker
Title: High-Speed Circuit Board Signal Integrity, Author: Stephen C. Thierauf
Title: Handbook of Flexible Circuits, Author: Ken Gilleo
Title: Handbook of Printed Circuit Manufacturing, Author: Raymond H. Clark
Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging, Author: Xing-Chang Wei
Title: Foldable Flex and Thinned Silicon Multichip Packaging Technology, Author: John W. Balde
Title: Placement and Routing of Electronic Modules, Author: Michael Pecht
Title: Advanced Routing of Electronic Modules, Author: Michael Pecht

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