Title: Review of the Federal Strategy for Nanotechnology-Related Environmental, Health, and Safety Research, Author: National Research Council
Title: Research Opportunities for Materials with Ultrafine Microstructures, Author: National Research Council
Title: Implications of Nanotechnology for Environmental Health Research, Author: Institute of Medicine
Title: Nanotechnology in Construction for Circular Economy: Proceedings of NICOM7, 31 October-02 November, 2022, Melbourne, Australia, Author: Wenhui Duan
Title: Ion Beam Processes in Advanced Electronic Materials and Device Technology: Volume 45, Author: B. R. Appleton
Title: Low-K Nanoporous Interdielectrics: Materials, Thin Film Fabrications, Structures and Properties, Author: Moonhor Ree
Title: Physical Properties Of Carbon Nanotubes, Author: G Dresselhaus
Title: Advanced Metallizations in Microelectronics: Volume 181, Author: Avishay Katz
Title: Chemical Processing of Dielectrics, Insulators and Electronic Ceramics: Volume 606, Author: Anthony C. Jones
Title: Materials, Integration and Technology for Monolithic Instruments: Volume 869, Author: Jeremy A. Theil
Title: Materials Science of High Temperature Polymers for Microelectronics: Volume 227, Author: D. T. Grubb
Title: Applications of Nanotechnology in Electrical Engineering, Author: Mishaal Ahmed
Title: Hybrid and Inorganic Perovskite Nanostructures, Author: Lioz Etgar
Title: Status and Applications of Diamond and Diamond-Like Materials: An Emerging Technology, Author: National Research Council
Title: 64 to 256-Megabit Reticle Generation: Technology Requirements and Approaches, Author: Gregory K. Hearn
Title: Development of Luminescence Properties of Eu3+-doped Nanosized Materials, Author: Lixin Yu
Title: Layered Structures and Epitaxy: Volume 56, Author: J. M. Gibson
Title: 3D Integration of Resistive Switching Memory, Author: Qing Luo
Title: Materials and Strategies for Lab-on-a-Chip - Biological Analysis, Cell-Material Interfaces and Fluidic Assembly of Nanostructures: Volume 1191, Author: Sashi K. Murthy
Title: Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10-12, 2007, San Francisco, California, U.S.A., Author: Qinghuang Lin

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