Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
Title: The Electronics Assembly Handbook, Author: Frank Riley
Title: Electronics Packaging Forum: Volume Two, Author: James E. Morris
Title: Quality Conformance and Qualification of Microelectronic Packages and Interconnects, Author: Michael G. Pecht
Title: MCM C/Mixed Technologies and Thick Film Sensors, Author: W.K. Jones
Title: Thermal Design of Electronic Equipment, Author: Ralph Remsburg
Title: Physical Design for Multichip Modules, Author: Mysore Sriram
Title: Handbook Of Tape Automated Bonding, Author: John H. Lau
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability, Author: James J. Licari
Title: Advanced Wirebond Interconnection Technology, Author: Shankara K. Prasad
Title: High Temperature Electronics, Author: F. Patrick McCluskey
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: Contamination of Electronic Assemblies, Author: Elissa M. Bumiller
Title: Air Cooling Technology for Electronic Equipment, Author: Sung Jin Kim
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing, Author: Shen Liu
Title: The Electronic Packaging Handbook, Author: Glenn R. Blackwell
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing, Author: Shen Liu
Title: Electronic Packaging Materials and Their Properties, Author: Michael Pecht
Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging, Author: Xing-Chang Wei

Pagination Links