Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
Title: The Electronics Assembly Handbook, Author: Frank Riley
Title: Electronics Packaging Forum: Volume Two, Author: James E. Morris
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: The Electronic Packaging Handbook, Author: Glenn R. Blackwell
Title: High Temperature Electronics, Author: F. Patrick McCluskey
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: Electronic Packaging and Interconnection Handbook, Author: Charles A. Harper
Title: Electronic Packaging Materials and Their Properties, Author: Michael Pecht
Title: MCM C/Mixed Technologies and Thick Film Sensors, Author: W.K. Jones
Title: Failure Modes and Mechanisms in Electronic Packages, Author: P. Singh
Title: Thermal Design of Electronic Equipment, Author: Ralph Remsburg
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
Title: Mechanical Analysis of Electronic Packaging Systems, Author: Stephen A. McKeown
Title: Electronic Equipment Packaging Technology, Author: Gerald L. Ginsberg
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability, Author: James J. Licari
Title: Soldering Processes and Equipment, Author: Michael G. Pecht
Title: Physical Design for Multichip Modules, Author: Mysore Sriram
Title: Advanced Materials for Thermal Management of Electronic Packaging, Author: Xingcun Colin Tong

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