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Title: 2D Electrostatic Fields: A Complex Variable Approach, Author: Robert L. Coffie
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Title: 2D Materials for Surface Plasmon Resonance-based Sensors, Author: Sanjeev Kumar Raghuwanshi
Title: 2D Nanoelectronics: Physics and Devices of Atomically Thin Materials, Author: Mircea Dragoman
Title: 2nd International Conference on 5G for Ubiquitous Connectivity: 5GU 2018, Author: Baoliu Ye
Title: 3D Integration for NoC-based SoC Architectures, Author: Abbas Sheibanyrad
Title: 3D Integration in VLSI Circuits: Implementation Technologies and Applications, Author: Katsuyuki Sakuma
Title: 3D Integration of Resistive Switching Memory, Author: Qing Luo
Title: 3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization, Author: Lennart Bamberg
Title: 3D Microelectronic Packaging: From Fundamentals to Applications, Author: Yan Li
Title: 3D Printer Projects for Makerspaces, Author: Lydia Sloan Cline
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Title: 3D Synthetic Environment Reconstruction, Author: Mahdi Abdelguerfi
Title: 3D TCAD Simulation for CMOS Nanoeletronic Devices, Author: Yung-Chun Wu
Title: 3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics, Author: Simon Li
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Title: 3D-TV System with Depth-Image-Based Rendering: Architectures, Techniques and Challenges, Author: Ce Zhu
Title: 3rd EAI International Conference on Robotic Sensor Networks: ROSENET 2019, Author: Yujie Li

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