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Title: Electronic Packaging and Interconnection Handbook / Edition 4, Author: Charles A. Harper
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Electronic Packaging and…
by Charles A. Harper
Hardcover $250.00
Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Stephen A. McKeown
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Mechanical Analysis of…
by Stephen A. McKeown
#120 in Series
Hardcover $350.00
Title: Electronic Packaging Materials and Their Properties / Edition 1, Author: Michael Pecht
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Electronic Packaging Materials…
by Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour
#4 in Series
Hardcover $210.00
Title: Thermal Design of Electronic Equipment / Edition 1, Author: Ralph Remsburg
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Thermal Design of Electronic…
by Ralph Remsburg
#10 in Series
Hardcover $240.00
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan / Edition 1, Author: K. Otsuka
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Multilayer Ceramic Substrate -…
by K. Otsuka
Explore Series
Hardcover $329.99
Title: Hermeticity of Electronic Packages / Edition 2, Author: Hal Greenhouse
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Hermeticity of Electronic…
by Hal Greenhouse
Hardcover $199.00
Title: MCM C/Mixed Technologies and Thick Film Sensors / Edition 1, Author: W.K. Jones
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MCM C/Mixed Technologies and…
by W.K. Jones, Karel Kurzweil, Gïbor Harsïnyi, Sylvia Mergui
#2 in Series
Hardcover $219.99
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies / Edition 1, Author: Karl J. Puttlitz
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Handbook of Lead-Free Solder…
by Karl J. Puttlitz, Kathleen A. Stalter
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Hardcover $525.00
Title: The Electronic Packaging Handbook / Edition 1, Author: Glenn R. Blackwell
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The Electronic Packaging…
by Glenn R. Blackwell
#4 in Series
Hardcover $300.00
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition / Edition 3, Author: Ali Jamnia
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Practical Guide to the…
by Ali Jamnia
Hardcover $220.00
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
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Guidebook for Managing Silicon…
by Michael Pecht, Riko Radojcic, Gopal Rao
#5 in Series
Hardcover $140.00
Title: Manufacturing Challenges in Electronic Packaging / Edition 1, Author: Y.C. Lee
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Manufacturing Challenges in…
by Y.C. Lee, W.T. Chen
Hardcover $109.99
Title: High-Frequency Characterization of Electronic Packaging / Edition 1, Author: Luc Martens
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High-Frequency…
by Luc Martens
#1 in Series
Hardcover $109.99
Title: Failure Modes and Mechanisms in Electronic Packages / Edition 1, Author: P. Singh
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Failure Modes and Mechanisms…
by P. Singh, Puligandla Viswanadham
Hardcover $169.99
Title: Advanced Materials for Thermal Management of Electronic Packaging / Edition 1, Author: Xingcun Colin Tong
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Advanced Materials for Thermal…
by Xingcun Colin Tong
#30 in Series
Hardcover $279.99
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004 / Edition 1, Author: S. Kakaï
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Microscale Heat Transfer -…
by S. Kakaï, L.L. Vasiliev, Y. Bayazitoglu, Y. Yener
#193 in Series
Hardcover $329.99
Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability / Edition 1, Author: Michael G. Pecht
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Integrated Circuit, Hybrid,…
by Michael G. Pecht
Hardcover $212.95
Title: Physical Design for Multichip Modules / Edition 1, Author: Mysore Sriram
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Physical Design for Multichip…
by Mysore Sriram, Sung-Mo (Steve) Kang
#267 in Series
Hardcover $169.99
Title: Electronic Equipment Packaging Technology / Edition 1, Author: Gerald L. Ginsberg
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Electronic Equipment Packaging…
by Gerald L. Ginsberg
Hardcover $109.99
Title: The Handbook of Machine Soldering: SMT and TH / Edition 3, Author: Ralph W. Woodgate
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The Handbook of Machine…
by Ralph W. Woodgate
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Hardcover $218.95

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