Title: Failure Modes and Mechanisms in Electronic Packages / Edition 1, Author: P. Singh
Title: Electronic Equipment Packaging Technology / Edition 1, Author: Gerald L. Ginsberg
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan / Edition 1, Author: K. Otsuka
Title: Advanced Materials for Thermal Management of Electronic Packaging / Edition 1, Author: Xingcun Colin Tong
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing / Edition 1, Author: Shen Liu
Title: Fundamentals and Essentials of Electronic Packaging, Author: Puligandla Viswanadham
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: Electronic Packaging and Interconnection Handbook / Edition 4, Author: Charles A. Harper
Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications / Edition 1, Author: Dean L. Monthei
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004 / Edition 1, Author: S. Kakaï

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