Title: High-Frequency Characterization of Electronic Packaging / Edition 1, Author: Luc Martens
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing / Edition 1, Author: Shen Liu
Title: Boundary-Scan Interconnect Diagnosis / Edition 1, Author: Josï T. de Sousa
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies / Edition 1, Author: Karl J. Puttlitz
Title: MCM C/Mixed Technologies and Thick Film Sensors / Edition 1, Author: W.K. Jones
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition / Edition 3, Author: Ali Jamnia
Title: Electronic Packaging and Interconnection Handbook / Edition 4, Author: Charles A. Harper
Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Mckeown
Title: Soldering Processes and Equipment / Edition 1, Author: Michael Pecht
Title: Air Cooling Technology for Electronic Equipment / Edition 1, Author: Sung Jin Kim
Title: Physical Design for Multichip Modules / Edition 1, Author: Mysore Sriram
Title: Laser Diode Chip and Packaging Technology, Author: Pei C. Chen
Title: Chip On Board: Technology for Multichip Modules / Edition 1, Author: John H. Lau
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
Title: Advanced Wirebond Interconnection Technology / Edition 1, Author: Shankara K. Prasad
Title: Electronic Equipment Packaging Technology / Edition 1, Author: Gerald L. Ginsberg
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach / Edition 1, Author: Pradeep Lall
Title: Handbook of Polymer Coatings for Electronics: Chemistry, Technology and Applications / Edition 2, Author: James J. Licari
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: Failure Modes and Mechanisms in Electronic Packages / Edition 1, Author: P. Singh

Pagination Links