Design And Modeling For 3d Ics And Interposers
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
1115750964
Design And Modeling For 3d Ics And Interposers
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
137.0
In Stock
5
1
Design And Modeling For 3d Ics And Interposers
380
Design And Modeling For 3d Ics And Interposers
380
137.0
In Stock
Product Details
| ISBN-13: | 9789814508599 |
|---|---|
| Publisher: | World Scientific Publishing Company, Incorporated |
| Publication date: | 12/24/2013 |
| Series: | Wspc Series In Advanced Integration And Packaging , #2 |
| Pages: | 380 |
| Product dimensions: | 7.20(w) x 11.10(h) x 1.30(d) |
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