Foldable Flex and Thinned Silicon Multichip Packaging Technology
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

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Foldable Flex and Thinned Silicon Multichip Packaging Technology
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

169.99 In Stock
Foldable Flex and Thinned Silicon Multichip Packaging Technology

Foldable Flex and Thinned Silicon Multichip Packaging Technology

Foldable Flex and Thinned Silicon Multichip Packaging Technology

Foldable Flex and Thinned Silicon Multichip Packaging Technology

Paperback(Softcover reprint of the original 1st ed. 2003)

$169.99 
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Overview

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.


Product Details

ISBN-13: 9781461349778
Publisher: Springer US
Publication date: 02/23/2014
Series: Emerging Technology in Advanced Packaging , #1
Edition description: Softcover reprint of the original 1st ed. 2003
Pages: 347
Product dimensions: 6.10(w) x 9.25(h) x 0.03(d)

Table of Contents

1. 3-D Assemblies of Stacked Chips and other Thin Packages.- 2. Multi-Chip Carriers in a System-on-a-Chip World.- 3. Packaging Technologies for Flexible Systems.- 4. Low Profile and Flexible Electronic Assemblies Using Ultra-Thin Silicon - The European Flex-Si Project.- 5. Thin Chips for Flexible and 3-D Integrated Electronic Systems.- 6. Flexible Microarray Interconnection Techniques Applied to Biomedical Microdevices.- 7. Folded Flex and other Structures for System-in-a Package.- 8. Valtronic CSP3D Technology.- 9. 3-D Packaging Technologies: Are Flex based Solutions the Answer?.- 10. Availability of High Density Interconnect Flexible Circuits.- 11. Recent Advances in Flexible Circuit Technology Using Liquid Crystal Polymer Substrates.- 12. Flex and the Interconnected Mesh Power System (IMPS).- 13. Thermal Management and Control of Electromagnetic Emissions.- Conclusions.- Authors’ Biographies.
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