Table of Contents
Contributor List. About IMAPS; P. Barnwell, President, IMAPS. Introduction; J. Balde. 1. 3-D Assemblies of Stacked Chips and other Thin Packages; J. Balde. 2. Multi-Chip Carriers in a System-on-a-Chip World; E. Davidson. 3. Packaging Technologies for Flexible Systems; C. Kallmayer. 4. Low Profile and Flexible Electronic Assemblies Using Ultra-Thin Silicon - The European Flex-Si Project; T. Harder. 5. Thin Chips for Flexible and 3-D Integrated Electronic Systems; K. Bock, M. Feil, C. Landesberger. 6. Flexible Microarray Interconnection Techniques Applied to Biomedical Microdevices; J.-U. Meyer, M. Schuetter, O. Scholz, W. Haberer, T. Steiglitz. 7. Folded Flex and other Structures for System-in-a Package; M. Warner, W. Carlson. 8. Valtronic CSP3D Technology; G. Rochat, P. Clot, J.-F. Zeberti. 9. 3-D Packaging Technologies: Are Flex based Solutions the Answer? T. Tessier. 10. Availability of High Density Interconnect Flexible Circuits; E.J. Vardaman, D. Numakura. 11. Recent Advances in Flexible Circuit Technology Using Liquid Crystal Polymer Substrates; Rui Yang, T.F. Hayden. 12. Flex and the Interconnected Mesh Power System (IMPS); L.W. Schaper. 13. Thermal Management and Control of Electromagnetic Emissions; C. Zweben. Conclusions; J. Balde. Authors' Biographies. Index.
