Foldable Flex and Thinned Silicon Multichip Packaging Technology
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
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Foldable Flex and Thinned Silicon Multichip Packaging Technology
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
169.99
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Foldable Flex and Thinned Silicon Multichip Packaging Technology
347
Foldable Flex and Thinned Silicon Multichip Packaging Technology
347Paperback(Softcover reprint of the original 1st ed. 2003)
$169.99
169.99
In Stock
Product Details
ISBN-13: | 9781461349778 |
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Publisher: | Springer US |
Publication date: | 02/23/2014 |
Series: | Emerging Technology in Advanced Packaging , #1 |
Edition description: | Softcover reprint of the original 1st ed. 2003 |
Pages: | 347 |
Product dimensions: | 6.10(w) x 9.25(h) x 0.03(d) |
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