Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability

by Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma

Overview

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

Product Details

ISBN-13:	9781461492658
Publisher:	Springer US
Publication date:	11/06/2014
Edition description:	2015
Pages:	253
Product dimensions:	6.10(w) x 9.25(h) x 0.02(d)

Table of Contents

Introduction.- Interconnection : The Joint.- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys.- Microstructure Development; Solidification and Isothermal Aging.- Thermal Cycling Performance.- Mechanical Stability and Performance.- Chemical and Environment Attack.- Challenges in Future Generation Interconnects: Microstructure Again.

Editorial Reviews

From the book reviews:

“The book gives wide perspectives on the technical insights of lead-free solder interconnect system and reliability prediction in industry while adding very valuable industry insights. It is a good resource to demonstrate the many facets of lead-free solder interconnection, and can serve as a very informative technical reference. Valuable as a learning tool for fundamentals of lead-free solder interconnect technology, its clear relevance to real world industry practices make it useful for both academics and semiconductor industry practitioners.” (Chong Leong Gan and Uda Hashim, Microelectronics Reliability, February, 2015)

From the Publisher