Low-Power CMOS Digital Pixel Imagers for High-Speed Uncooled PbSe IR Applications
This book describes the development of a new low-cost medium wavelength IR (MWIR) monolithic imager technology for high-speed uncooled industrial applications. It takes the baton on the latest technological advances in the field of vapor phase deposition (VPD) PbSe-based MWIR detection accomplished by the industrial partner NIT S.L., adding fundamental knowledge on the investigation of novel VLSI analog and mixed-signal design techniques at circuit and system levels for the development of the readout integrated device attached to the detector. In order to fulfill the operational requirements of VPD PbSe, this work proposes null inter-pixel crosstalk vision sensor architectures based on a digital-only focal plane array (FPA) of configurable pixel sensors. Each digital pixel sensor (DPS) cell is equipped with fast communication modules, self-biasing, offset cancellation, analog-to-digital converter (ADC) and fixed patternnoise (FPN) correction. In-pixel power consumption is minimized by the use of comprehensive MOSFET subthreshold operation.

1125393503
Low-Power CMOS Digital Pixel Imagers for High-Speed Uncooled PbSe IR Applications
This book describes the development of a new low-cost medium wavelength IR (MWIR) monolithic imager technology for high-speed uncooled industrial applications. It takes the baton on the latest technological advances in the field of vapor phase deposition (VPD) PbSe-based MWIR detection accomplished by the industrial partner NIT S.L., adding fundamental knowledge on the investigation of novel VLSI analog and mixed-signal design techniques at circuit and system levels for the development of the readout integrated device attached to the detector. In order to fulfill the operational requirements of VPD PbSe, this work proposes null inter-pixel crosstalk vision sensor architectures based on a digital-only focal plane array (FPA) of configurable pixel sensors. Each digital pixel sensor (DPS) cell is equipped with fast communication modules, self-biasing, offset cancellation, analog-to-digital converter (ADC) and fixed patternnoise (FPN) correction. In-pixel power consumption is minimized by the use of comprehensive MOSFET subthreshold operation.

109.99 In Stock
Low-Power CMOS Digital Pixel Imagers for High-Speed Uncooled PbSe IR Applications

Low-Power CMOS Digital Pixel Imagers for High-Speed Uncooled PbSe IR Applications

by Josep Maria Margarit
Low-Power CMOS Digital Pixel Imagers for High-Speed Uncooled PbSe IR Applications

Low-Power CMOS Digital Pixel Imagers for High-Speed Uncooled PbSe IR Applications

by Josep Maria Margarit

Hardcover(1st ed. 2017)

$109.99 
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Overview

This book describes the development of a new low-cost medium wavelength IR (MWIR) monolithic imager technology for high-speed uncooled industrial applications. It takes the baton on the latest technological advances in the field of vapor phase deposition (VPD) PbSe-based MWIR detection accomplished by the industrial partner NIT S.L., adding fundamental knowledge on the investigation of novel VLSI analog and mixed-signal design techniques at circuit and system levels for the development of the readout integrated device attached to the detector. In order to fulfill the operational requirements of VPD PbSe, this work proposes null inter-pixel crosstalk vision sensor architectures based on a digital-only focal plane array (FPA) of configurable pixel sensors. Each digital pixel sensor (DPS) cell is equipped with fast communication modules, self-biasing, offset cancellation, analog-to-digital converter (ADC) and fixed patternnoise (FPN) correction. In-pixel power consumption is minimized by the use of comprehensive MOSFET subthreshold operation.


Product Details

ISBN-13: 9783319499611
Publisher: Springer International Publishing
Publication date: 12/31/2016
Series: Springer Theses
Edition description: 1st ed. 2017
Pages: 173
Product dimensions: 6.10(w) x 9.25(h) x 0.02(d)

Table of Contents

Introduction.- Frame-Based Smart IR Imagers.- Frame-Free Compact-Pitch IR Imagers.- Pixel Test Chips in 0.35mm and 0.15mm CMOS Technologies.- Imager Test Chips in 2.5mm, 0.35mm and 0.15mm CMOS Technologies.- Conclusions.
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