ISBN-10:
1402017650
ISBN-13:
9781402017650
Pub. Date:
12/31/2003
Publisher:
Springer Netherlands
Structural Integrity and Reliability in Electronics: Enhancing Performance in a Lead-Free Environment / Edition 1

Structural Integrity and Reliability in Electronics: Enhancing Performance in a Lead-Free Environment / Edition 1

Hardcover

Current price is , Original price is $249.99. You

Temporarily Out of Stock Online

Please check back later for updated availability.

Overview

The World's largest industrial sector, Electronics, is facing twin challenges arising from the transition to environmentally-benign solder alloys and the necessity to maintain structural integrity and reliability in the face of continuing miniaturisation. This book is probably the first to address the situation from a multidisciplinary teaching perspective. The authors' expertise in Materials, Electronics Manufacture and Design are integrated throughout to establish a common platform and language for practitioners from the many fields involved. Communication is facilitated by a dual-level of presentation of the subject principles and the latest developments in industry and in research. Electronic routes for monitoring current and future progress are also provided. The book will appeal both to specialists wanting to update or increase their appreciation of related topics, and the generalist seeking relevant applications. It represents a major contribution to the field.

Product Details

ISBN-13: 9781402017650
Publisher: Springer Netherlands
Publication date: 12/31/2003
Edition description: 2003
Pages: 336
Product dimensions: 6.10(w) x 9.25(h) x 0.03(d)

Table of Contents

Setting the Scene.- to the Properties of Materials.- More Complex Mechanical Behaviour.- Mechanical Testing (For Electronics Applications).- Mechanical Properties of Bulk Solders.- Mechanical Behaviour of Solder Joints.- Electronic Components and Their Construction.- Printed Circuit Board Assembly Methods and Technologies.- Fundamentals of Failure Analysis.- Analysis of PCB and Electronic Component Failure.- Making the Transition to a Reliable Lead-free Solder Process.- to Life Prediction.- Life Prediction by Crack Propagation Approach.- Reliability and Statistical Analysis of Data.- Thermal and Mechanical Simulation in Microelectronics.- Finite Element Analysis.- Non-linear Finite Element Analysis.- Case Study.

Customer Reviews